International Patent: METHOD FOR TUNGSTEN-BASED THIN FILM DEPOSITION VIA FABRICATION AND DECOMPOSITION OF PRECURSOR METASTABLE COMPLEXES (MOLECULAR SPECIES)

GENEVA, June 19 -- KALARK NANOSTRUCTURE SCIENCES INC. filed a patent application (US2025/054099) for “METHOD FOR TUNGSTEN-BASED THIN FILM DEPOSITION VIA FABRICATION AND DECOMPOSITION OF PRECURSOR METASTABLE COMPLEXES (MOLECULAR SPECIES)”. With publication no. WO/2026/106846, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 16/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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