International Patent: METHOD FOR PRODUCING SILICON CARBIDE WAFER

GENEVA, July 9 -- DENSO CORPORATION filed a patent application (JP2025/045690) for “METHOD FOR PRODUCING SILICON CARBIDE WAFER”. With publication no. WO/2026/146631, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C30B 29/36

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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