International Patent: METHOD FOR PRODUCING NANOPOROUS COPPER STRUCTURE, NANOPOROUS COPPER STRUCTURE, AND ELECTROLESS COPPER-PLATING SOLUTION

GENEVA, Aug. 31 -- MITSUBISHI MATERIALS CORPORATION filed a patent application (JP2026/005910) for “METHOD FOR PRODUCING NANOPOROUS COPPER STRUCTURE, NANOPOROUS COPPER STRUCTURE, AND ELECTROLESS COPPER-PLATING SOLUTION”. With publication no. WO/2026/177157, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 28/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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