International Patent: METHOD FOR PRODUCING A POWER SEMICONDUCTOR ARRANGEMENT HAVING A HEAT PIPE

GENEVA, Aug. 14 -- SIEMENS AKTIENGESELLSCHAFT filed a patent application (EP2026/051271) for “METHOD FOR PRODUCING A POWER SEMICONDUCTOR ARRANGEMENT HAVING A HEAT PIPE”. With publication no. WO/2026/166749, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/47

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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