GENEVA, Oct. 5 -- FUJIFILM CORPORATION filed a patent application (JP2026/009357) for “METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, RESIN COMPOSITION FOR FORMING INSULATING FILM, AND PHOTOSENSITIVE RESIN COMPOSITION”. With publication no. WO/2026/204368, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 20/48
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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