GENEVA, July 27 -- FUJIFILM CORPORATION filed a patent application (JP2026/000942) for “METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, RESIN COMPOSITION, AND RESIN COMPOSITION FOR TEMPORARY ADHESIVE LAYER”. With publication no. WO/2026/155176, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 56/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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