GENEVA, Aug. 31 -- ELEPHANTECH INC. filed a patent application (JP2026/006188) for “METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, MATERIAL FOR CIRCUIT SUBSTRATE, AND INKJET PRINTER FOR MANUFACTURING CIRCUIT SUBSTRATE”. With publication no. WO/2026/177184, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 3/10
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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