International Patent: METHOD FOR IMPLEMENTING SELF-ALIGNED DOUBLE PATTERNING, CONTROLLER, AND CHIP PRODUCTION SYSTEM

GENEVA, June 26 -- INTERNATIONAL INNOVATION CENTER OF TSINGHUA UNIVERSITY, SHANGHAI filed a patent application (CN2025/073655) for “METHOD FOR IMPLEMENTING SELF-ALIGNED DOUBLE PATTERNING, CONTROLLER, AND CHIP PRODUCTION SYSTEM”. With publication no. WO/2026/118169, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/033

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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