GENEVA, Aug. 31 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/041582) for “METHOD FOR FORMING A SILICON ON INSULATOR SUBSTRATE”. With publication no. WO/2026/177762, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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