International Patent: METHOD FOR CHEMICAL-MECHANICAL POLISHING OF A SUBSTRATE SEMICONDUCTOR WAFER

GENEVA, Sept. 7 -- SILTRONIC AG filed a patent application (EP2026/054557) for “METHOD FOR CHEMICAL-MECHANICAL POLISHING OF A SUBSTRATE SEMICONDUCTOR WAFER”. With publication no. WO/2026/180345, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B24B 37/005

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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