GENEVA, Aug. 7 -- ENTEC-STRACON GMBH filed a patent application (EP2026/052620) for “METHOD AND DEVICE FOR PRODUCING A COMPONENT BY MEANS OF DIE CASTING”. With publication no. WO/2026/162804, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B22D 17/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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