GENEVA, July 18 -- THE HONG KONG POLYTECHNIC UNIVERSITY filed a patent application (CN2025/108125) for “METHOD AND APPARATUS FOR PLANNING/DESIGNING LAYOUT OF CONSTRUCTION SITE”. With publication no. WO/2026/012470, here are the other details related to the patent application:
Kind: Corrected version of pamphlet [A9]
IPC: G06Q 10/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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