International Patent: METAL PASTE, METHOD FOR MANUFACTURING SUBSTRATE HAVING CONDUCTIVE VIAS, AND SUBSTRATE HAVING CONDUCTIVE VIAS

GENEVA, Oct. 22 -- RESONAC CORPORATION filed a patent application (JP2025/014654) for “METAL PASTE, METHOD FOR MANUFACTURING SUBSTRATE HAVING CONDUCTIVE VIAS, AND SUBSTRATE HAVING CONDUCTIVE VIAS”. With publication no. WO/2026/220461, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01B 1/22

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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