GENEVA, Oct. 22 -- LEE, Wing Hong filed a patent application (CN2025/143785) for “METAL NAIL FOR FIXING WALL INSULATION LAYER”. With publication no. WO/2026/218655, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: E04B 1/38
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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