International Patent: METAL DEPOSITION AND ETCH BY USE OF A SUBSTRATE PROCESSING CHAMBER

GENEVA, Aug. 21 -- APPLIED MATERIALS, INC. filed a patent application (US2026/014661) for “METAL DEPOSITION AND ETCH BY USE OF A SUBSTRATE PROCESSING CHAMBER”. With publication no. WO/2026/173871, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01J 37/32

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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