GENEVA, June 19 -- APPLIED MATERIALS, INC. filed a patent application (US2024/056182) for “METAL-CONTAINING MATERIAL ETCH METHODS”. With publication no. WO/2026/106608, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/311
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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