INTERNATIONAL PATENT: META PLATFORMS TECHNOLOGIES, LLC FILES APPLICATION FOR "MULTI-LAYER DEFORMABLE LIQUID-METAL CIRCUITS AND INTERCONNECTS WITH IMPROVED RELIABILITY"

GENEVA, Feb. 11 -- META PLATFORMS TECHNOLOGIES, LLC (1 Meta WayMenlo Park, California 94025) filed a patent application (PCT/US2025/040496) for "MULTI-LAYER DEFORMABLE LIQUID-METAL CIRCUITS AND INTERCONNECTS WITH IMPROVED RELIABILITY" on Aug 04, 2025. With publication no. WO/2026/030746, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AWARTANI, Omar (1 Meta WayMenlo Park, California 94025), ANDRADE, Marcos Antonio Santana (1 Meta WayMenlo Park, California 94025), SADRI, Behnam (1 Meta WayMenlo Park, California 94025), KHB...