GENEVA, March 17 -- MEIKO ELECTRONICS CO., LTD. (5-14-15, Ogami, Ayase-shi Kanagawa2521104), 株式会社メイコー (神奈川県綾瀬市大上５丁目１４番１５号) filed a patent application (PCT/JP2024/031728) for "ALUMINUM WIRING HEAT DISSIPATION SUBSTRATE" on Sep 04, 2024. With publication no. WO/2026/053312, the details related to the patent application was published on Mar 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAYA, Shigeru (c/o MEIKO...