International Patent: MEASUREMENT DEVICE, SEMICONDUCTOR WAFER TESTER, AND MEASUREMENT METHOD

GENEVA, July 18 -- HITACHI, LTD. filed a patent application (JP2025/037603) for “MEASUREMENT DEVICE, SEMICONDUCTOR WAFER TESTER, AND MEASUREMENT METHOD”. With publication no. WO/2026/150642, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01R 31/28

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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