GENEVA, Aug. 11 -- MAX CO., LTD. (6-6, Nihonbashi Hakozaki-cho, Chuo-ku, Tokyo1038502), マックス株式会社 (東京都中央区日本橋箱崎町６番６号) filed a patent application (PCT/JP2024/043699) for "BINDING SYSTEM AND BINDING PROCESSING PROGRAM" on Dec 10, 2024. With publication no. WO/2025/164098, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KASAHARA Akira (c/o MAX CO., LTD., 6-6, Ni...