GENEVA, Aug. 7 -- HORIBA STEC, CO., LTD. filed a patent application (JP2025/040009) for “MATERIAL VAPORIZATION SYSTEM, MATERIAL VAPORIZATION METHOD, AND MATERIAL VAPORIZATION PROGRAM”. With publication no. WO/2026/163570, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C23C 16/448
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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