GENEVA, Oct. 15 -- RESONAC CORPORATION filed a patent application (JP2025/013915) for “MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE”. With publication no. WO/2026/215957, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/683
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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