International Patent: MANUFACTURABLE ULTRA-THIN STACKED COMPUTE AND MEMORY INTEGRATED CIRCUIT CUBE FOR HIGH BANDWIDTH AND CAPACITY

GENEVA, July 27 -- MUEON CORPORATION filed a patent application (US2025/059438) for “MANUFACTURABLE ULTRA-THIN STACKED COMPUTE AND MEMORY INTEGRATED CIRCUIT CUBE FOR HIGH BANDWIDTH AND CAPACITY”. With publication no. WO/2026/155857, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 90/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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