GENEVA, Sept. 24 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2026/080818) for “MAGNESIUM ALLOY AND PREPARATION METHOD THEREFOR, STRUCTURAL MEMBER, AND ELECTRONIC DEVICE”. With publication no. WO/2026/194635, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C22C 23/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....