INTERNATIONAL PATENT: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC. FILES APPLICATION FOR "ENHANCED BACK VIA LANDING METAL LAYER ADHESION"

GENEVA, Jan. 13 -- MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC. (100 Chelmsford StreetLowell, Massachusetts 01851) filed a patent application (PCT/US2025/022777) for "ENHANCED BACK VIA LANDING METAL LAYER ADHESION" on Apr 02, 2025. With publication no. WO/2026/010661, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PAL, Debdas (100 Chelmsford StreetLowell, Massachusetts 01851), GEHLERT, Kimberly (100 Chelmsford StreetLowell, Massachusetts 01851)

Abstract: Landing metal layers with improved adhesion to semiconductor substrat...