International Patent: LOW-K SIOC ETCH RESISTANCE IMPROVEMENT BY HOT IMPLANT

GENEVA, June 26 -- APPLIED MATERIALS, INC. filed a patent application (US2025/058345) for “LOW-K SIOC ETCH RESISTANCE IMPROVEMENT BY HOT IMPLANT”. With publication no. WO/2026/122929, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 30/40

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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