INTERNATIONAL PATENT: LOTUS MICROSYSTEMS APS FILES APPLICATION FOR "METHOD OF MANUFACTURING HIGH-DENSITY THROUGH-SILICON VIAS"

GENEVA, Dec. 22 -- LOTUS MICROSYSTEMS APS (Stamholmen 1532650 Hvidovre) filed a patent application (PCT/EP2025/066624) for "METHOD OF MANUFACTURING HIGH-DENSITY THROUGH-SILICON VIAS" on Jun 13, 2025. With publication no. WO/2025/257409, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): THANH, Hoa Le (c/o Lotus Microsystems ApSStamholmen 1532650 Hvidovre), AMMAR, Ahmed Morsi (c/o Lotus Microsystems ApSStamholmen 1532650 Hvidovre), NOUR, Yasser A. A. (c/o Lotus Microsystems ApSStamholmen 1532650 Hvidovre), KANG, Junghyun (c/o...