GENEVA, Aug. 14 -- MIKROS TECHNOLOGIES LLC filed a patent application (US2026/011784) for “LIQUID-COOLING EMBEDDED CHIP LID”. With publication no. WO/2026/169428, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 40/47
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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