INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME"

GENEVA, April 7 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2025/033955) for "MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME" on Sep 26, 2025. With publication no. WO/2026/071014, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSURUMA, Yuko (c/o LINTEC Corporation, 23-23, Honc...