INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "ELECTRONIC COMPONENT MANUFACTURING METHOD AND ELECTRONIC COMPONENT PROCESSING DEVICE"

GENEVA, May 5 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋区本町２３番２３号) filed a patent application (PCT/JP2025/036790) for "ELECTRONIC COMPONENT MANUFACTURING METHOD AND ELECTRONIC COMPONENT PROCESSING DEVICE" on Oct 20, 2025. With publication no. WO/2026/088901, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUEYOSHI Haruki (c/...