INTERNATIONAL PATENT: LINCOLN GLOBAL, INC. FILES APPLICATION FOR "POWER SOURCE ENCLOSURE"

GENEVA, April 29 -- LINCOLN GLOBAL, INC. (22801 Saint Clair AvenueCleveland, Ohio 44117) filed a patent application (PCT/US2025/050709) for "POWER SOURCE ENCLOSURE" on Oct 13, 2025. With publication no. WO/2026/085018, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BORREGO, Didier (5 Allee du Bois Coupe60500 Vineuil Saint Firmin), GREINER, Pawel (2. ul. Juliana Tuwima 2458-260 Bielawa)

Abstract: A power source for a welding or cutting application includes an enclosure defining an internal cavity for housing electronics....