GENEVA, March 29 -- LIAKO TECH. CORP. (Floor 1, No. 12, Lane 660, Huacheng Road, Xinzhuang District, New Taipei CityTaiwan 242042), 嵩庆欣业有限公司 (中国台湾省新北市新庄区化成路660巷12号1楼) filed a patent application (PCT/CN2025/075237) for "TIGHT-BONDING STRUCTURE" on Jan 26, 2025. With publication no. WO/2026/060877, the details related to the patent application was published on Mar 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KUO, T...