GENEVA, Oct. 5 -- HBL CORPORATION filed a patent application (KR2026/001821) for “LASER CHAMFERING APPARATUS AND LASER CHAMFERING METHOD”. With publication no. WO/2026/205750, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B23K 26/38
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....