GENEVA, Aug. 21 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/132279) for “LASER AMPLIFICATION ASSEMBLY, LASER, AND LASER PROCESSING DEVICE”. With publication no. WO/2026/170764, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01S 5/183
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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