GENEVA, Nov. 6 -- RESONAC CORPORATION filed a patent application (JP2025/016283) for “LAMINATE, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/230044, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 17/10
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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