INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "IMPROVED WAFER TEMPERATURE UNIFORMITY VIA LOCALIZED INCREASE IN SUBSTRATE CONTACT SURFACE AREA DENSITY"

GENEVA, March 4 -- LAM RESEARCH CORPORATION (4650 Cushing ParkwayFremont, California 94538) filed a patent application (PCT/US2025/042804) for "IMPROVED WAFER TEMPERATURE UNIFORMITY VIA LOCALIZED INCREASE IN SUBSTRATE CONTACT SURFACE AREA DENSITY" on Aug 20, 2025. With publication no. WO/2026/044003, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YU, Yixuan (4650 Cushing ParkwayFremont, California 94538), SAMULON, Eric (4650 Cushing ParkwayFremont, California 94538), LIU, Sai (4650 Cushing ParkwayFremont, California 9453...