INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "ETCHING THROUGH SILICON VIAS HAVING DIFFERENT SIZES WITH MINIMUM DEPTH LOADING"

GENEVA, April 29 -- LAM RESEARCH CORPORATION (4650 Cushing ParkwayFremont, CA 94538) filed a patent application (PCT/US2025/050653) for "ETCHING THROUGH SILICON VIAS HAVING DIFFERENT SIZES WITH MINIMUM DEPTH LOADING" on Oct 13, 2025. With publication no. WO/2026/084990, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FANG, Tong (4650 Cushing ParkwayFremont, CA 94538), PIMIENTA, Roberto; Pablo (4650 Cushing ParkwayFremont, CA 94538), SHIN, Jong Il (4650 Cushing ParkwayFremont, CA 94538)

Abstract: A method for etching a su...