INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "BOTTOM CLIPPED STUD-SOCKET ASSEMBLIES FOR DIELECTRIC ETCH CHAMBER ELECTRODES"

GENEVA, June 4 -- LAM RESEARCH CORPORATION (4650 Cushing ParkwayFremont, CA 94538) filed a patent application (PCT/US2024/052671) for "BOTTOM CLIPPED STUD-SOCKET ASSEMBLIES FOR DIELECTRIC ETCH CHAMBER ELECTRODES" on Oct 23, 2024. With publication no. WO/2025/111097, the details related to the patent application was published on May 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PENG, Gordon (4650 Cushing ParkwayFremont, CA 94538), LIN, I-chi (4650 Cushing ParkwayFremont, CA 94538)

Abstract: A stud-socket assembly includes: a stud pin having a head portion, a main body, and a neck por...