INTERNATIONAL PATENT: KYOCERA CORPORATION, 京セラ株式会社 FILES APPLICATION FOR "PACKAGING FOR CHIP-SHAPED ELECTRONIC COMPONENTS AND CHIP-SHAPED ELECTRONIC COMPONENT PACKAGED STRUCTURE"

GENEVA, Jan. 27 -- KYOCERA CORPORATION (6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto6128501), 京セラ株式会社 (京都府京都市伏見区竹田鳥羽殿町６番地) filed a patent application (PCT/JP2025/023584) for "PACKAGING FOR CHIP-SHAPED ELECTRONIC COMPONENTS AND CHIP-SHAPED ELECTRONIC COMPONENT PACKAGED STRUCTURE" on Jul 01, 2025. With publication no. WO/2026/018669, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...