GENEVA, Feb. 18 -- KLA CORPORATION (One Technology DriveMilpitas, California 95035) filed a patent application (PCT/US2025/041000) for "SYSTEM AND METHOD FOR WAFER SHAPE PAIRING FOR IMPROVED POST-BONDING PERFORMANCE" on Aug 07, 2025. With publication no. WO/2026/035902, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WANG, Xuewen (5th floor, Building NO.88Lane 887 Zu Chongzhi RoadShanghai, Shanghai 201210)
Abstract: A system for wafer pairing for wafer-to-wafer bonding may include a wafer shape metrology sub-system and c...