GENEVA, March 30 -- KEMIRA OYJ (Energiakatu 400180 Helsinki) filed a patent application (PCT/EP2025/076087) for "HEAT-SEALABLE ADHESIVE COMPOSITION AND USES THEREOF" on Sep 12, 2025. With publication no. WO/2026/061904, the details related to the patent application was published on Mar 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): CHEN, Ting (c/o Kemira Water Solutions Inc387 Nerem Street NWAtlanta, Georgia 30313), PEREZ-SAJCHE, Yessica (c/o Kemira Water Solutions Inc.387 Nerem Street NWAtlanta, Georgia 30313), BLAND, Bradley (c/o Kemira Water Solutions Inc.200 Galleria Parkway, Suite ...