GENEVA, Dec. 22 -- KAGA, INC. (6th floor, Iwaodaiwa Bldg, 11-10 Nihonbashikoami-cho, Chuo-ku, Tokyo1030016), かがつう株式会社 (東京都中央区日本橋小網町１１番１０号 岩尾大和ビル６階) filed a patent application (PCT/JP2024/021271) for "HEAT SINK AND ELECTRONIC COMPONENT HAVING HEAT SINK" on Jun 12, 2024. With publication no. WO/2025/257953, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manag...