International Patent: JOINT MEMBER OF WALL THERMAL INSULATION MATERIAL AND WALL THERMAL INSULATION STRUCTURE

GENEVA, July 27 -- SEKISUI HOUSE, LTD. filed a patent application (JP2025/023369) for “JOINT MEMBER OF WALL THERMAL INSULATION MATERIAL AND WALL THERMAL INSULATION STRUCTURE”. With publication no. WO/2026/154708, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: E04B 1/80

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....