INTERNATIONAL PATENT: IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), 한양대학교 산학협력단 FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE BONDING METHOD AND SEMICONDUCTOR PACKAGE BONDING APPARATUS USED THEREFOR"

GENEVA, Jan. 13 -- IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (222, Wangsimni-roSeongdong-guSeoul 04763), 한양대학교 산학협력단 (서울특별시성동구왕십리로 222) filed a patent application (PCT/KR2025/009209) for "SEMICONDUCTOR PACKAGE BONDING METHOD AND SEMICONDUCTOR PACKAGE BONDING APPARATUS USED THEREFOR" on Jun 30, 2025. With publication no. WO/2026/010282, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...