INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM UNITED KINGDOM LIMITED FILES APPLICATION FOR "SEMICONDUCTOR DEVICE WITH AN ETCH STOP LAYER AT THE MIDDLE OF LINE"

GENEVA, June 16 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonkNew York, 10504), IBM UNITED KINGDOM LIMITED (Building CIBM Hursley OfficeHursley Park RoadWinchester Hampshire SO21 2JN) filed a patent application (PCT/EP2024/081553) for "SEMICONDUCTOR DEVICE WITH AN ETCH STOP LAYER AT THE MIDDLE OF LINE" on Nov 07, 2024. With publication no. WO/2025/119579, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): QIN, Liqiao (IBM Corporation257 Fuller RoadAlbany, New York 12203-3654), LI, Tao (IBM Corporation...