INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM UNITED KINGDOM LIMITED, IBM (CHINA) COMPANY LIMITED FILES APPLICATION FOR "SEED STRUCTURES IN SEMICONDUCTOR DEVICES AND FABRICATION THEREOF"

GENEVA, March 2 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonkNew York, 10504), IBM UNITED KINGDOM LIMITED (Building CIBM Hursley OfficeHursley Park RoadWinchester Hampshire SO21 2JN), IBM (CHINA) COMPANY LIMITED (1F, Building A1No. 55 LaneChuan He RoadPudong New DistrictShanghai 201203) filed a patent application (PCT/IB2025/057057) for "SEED STRUCTURES IN SEMICONDUCTOR DEVICES AND FABRICATION THEREOF" on Jul 11, 2025. With publication no. WO/2026/041932, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Invento...