INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM ISRAEL - SCIENCE & TECHNOLOGY LTD, IBM (CHINA) COMPANY LIMITED FILES APPLICATION FOR "BACKSIDE POWER DELIVERY IN 3D DIE"

GENEVA, Nov. 3 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504New York, 10504), IBM ISRAEL - SCIENCE & TECHNOLOGY LTD (IBM ISRAEL - SCIENCE & TECHNOLOGY LTDHaifa University Campus165 Aba Khoushy AveMount Carmel31905 Haifa), IBM (CHINA) COMPANY LIMITED (1F, Building A1,No.55 Lane,Chuan He Road,Pudong New DistrictShanghai,, Shanghai 201203) filed a patent application (PCT/IB2025/052564) for "BACKSIDE POWER DELIVERY IN 3D DIE" on Mar 11, 2025. With publication no. WO/2025/224522, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Pr...