INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM (CHINA) COMPANY LIMITED, IBM ISRAEL - SCIENCE & TECHNOLOGY LTD. FILES APPLICATION FOR "SEMICONDUCTOR DEVICE WITH STACKED VIAS FOR HEAT REMOVAL"

GENEVA, April 28 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard Road,ArmonkNew York 10504), IBM (CHINA) COMPANY LIMITED (1F, Building A1No.55 Lane, Chuan He RoadPudong New DistrictShanghai 201203), IBM ISRAEL - SCIENCE & TECHNOLOGY LTD. (Haifa University Campus165 Aba Khoushy AveMount Carmel3498825 Haifa) filed a patent application (PCT/IB2025/059294) for "SEMICONDUCTOR DEVICE WITH STACKED VIAS FOR HEAT REMOVAL" on Sep 17, 2025. With publication no. WO/2026/083161, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(...