INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM (CHINA) COMPANY LIMITED, IBM ISRAEL - SCIENCE & TECHNOLOGY LTD FILES APPLICATION FOR "INTEGRATED PASSIVE DEVICE REGION WITH INCREASED SUBSTRATE THICKNESS"

GENEVA, Dec. 16 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504New York, 10504), IBM (CHINA) COMPANY LIMITED (1F, Building A1, No. 55 Lane, Chuan He Road, Pudong New DistrictShanghai, Shanghai 201203), IBM ISRAEL - SCIENCE & TECHNOLOGY LTD (IBM Israel - Science & Technology LtdHaifa University Campus165 Aba Khoushy Ave, Mount Carmel31905 Haifa) filed a patent application (PCT/IB2025/054942) for "INTEGRATED PASSIVE DEVICE REGION WITH INCREASED SUBSTRATE THICKNESS" on May 12, 2025. With publication no. WO/2025/253207, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which...