GENEVA, July 1 -- SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MATERIALS INDUSTRY INNOVATION CENTER CO., LTD. filed a patent application (CN2025/136692) for “INTERCONNECT STRUCTURE AND DESIGN METHOD THEREFOR”. With publication no. WO/2026/124178, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/528
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....